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Micro-texturing into DLC coating on the SKD11 die via the high-density plasma oxidation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Diamond-like carbon (DLC) has been widely utilized in industries; e.g., the protective coating of punches and dies. The high-density plasma oxidation was used to make selective removal of the DLC films and to construct the three-dimensional micro-texture on the SKD11. Two-dimensional micro-texture was drawn onto these films via the maskless lithography patterning. Micro-dots with various diameters were utilized as a mask to make selective removal of unmasked DLC surfaces. The optical emission spectroscopy (OES) was used to make oxygen plasma diagnosis and to identify the active species for this plasma etching. The Raman spectroscopy was employed to analyze the masked and unmasked area after the etching process. The etching took place homogeneously within 7.2 ks process. The three-dimensional micro-texture of DLC was formed with the height of 18 μm. The formed micro-textures have a standard deviation less than 1 μm.

Original languageEnglish
Title of host publicationProceedings - 12th SEATUC Symposium, SEATUC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538650943
DOIs
Publication statusPublished - Mar 2018
Event12th South East Asian Technical University Consortium Sysmposium, SEATUC 2018 - Yogyakarta, Indonesia
Duration: 12 Mar 2018 → 13 Mar 2018

Publication series

NameProceedings - 12th SEATUC Symposium, SEATUC 2018

Conference

Conference12th South East Asian Technical University Consortium Sysmposium, SEATUC 2018
Country/TerritoryIndonesia
CityYogyakarta
Period12/03/18 → 13/03/18

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • Diamond-like carbon
  • High-density plasma
  • Micro-texturing
  • Oxygen etching
  • Oxygen plasma
  • RF-DC plasma

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