TY - GEN
T1 - Enhancing PCB Quality Control with Deep Learning Based Defect Detection
AU - Mutebi, Shafiq
AU - Abidin, Zainul
AU - Setyawan, Raden Arief
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Ensuring high-quality PCBs is crucial for reliable electronic devices. Traditional inspection methods are often time-consuming and prone to errors, leading to the need for more efficient and accurate defect detection techniques. This research explores the use of deep learning models to enhance PCB quality control by automating the detection of defects such as missing holes, mouse bites, short circuits, and spurious copper. The research employed three object detection models: YOLOv8n, Faster R-CNN R50 FPN, and RetinaNet R50 FPN to detect and classify PCB defects. Data augmentation techniques such as horizontal/vertical flipping, grayscale conversion, hue adjustment, noise addition, saturation, blur, and brightness adjustments were applied to further improve model performance. Through comprehensive training on a labeled PCB dataset, the models were evaluated based on metrics such as mAP (mean Average Precision) and total loss. The results showed that YOLOv8n achieved the highest accuracy with a mAP@50 of 89.3% and mAP@50-95 of 45%, along with a superior inference speed of 5.9ms. Faster R-CNN R50 FPN followed with a mAP@50 of 85.9% and mAP@50-95 of 41.9%, and RetinaNet R50 FPN achieved a mAP@50 of 71.6% and mAP@50-95 of 34.5%. The results underscore YOLOv8n's suitability for real-time defect detection due to its combination of high accuracy and fast processing speed, while the other models, although improved after augmentation enhancement, did not match its performance. This research demonstrates the potential of deep learning models for automating PCB defect detection with high accuracy and efficiency, focusing on ordinary single-layered PCB surfaces. While effective, it does not address defect detection in multi-layered PCBs and faces challenges like defect complexity, data imbalance, and limited samples. Future work can explore multi-layered PCBs, improve model robustness and generalization, employ advanced augmentation techniques, and enhance model interpretability for practical reliability.
AB - Ensuring high-quality PCBs is crucial for reliable electronic devices. Traditional inspection methods are often time-consuming and prone to errors, leading to the need for more efficient and accurate defect detection techniques. This research explores the use of deep learning models to enhance PCB quality control by automating the detection of defects such as missing holes, mouse bites, short circuits, and spurious copper. The research employed three object detection models: YOLOv8n, Faster R-CNN R50 FPN, and RetinaNet R50 FPN to detect and classify PCB defects. Data augmentation techniques such as horizontal/vertical flipping, grayscale conversion, hue adjustment, noise addition, saturation, blur, and brightness adjustments were applied to further improve model performance. Through comprehensive training on a labeled PCB dataset, the models were evaluated based on metrics such as mAP (mean Average Precision) and total loss. The results showed that YOLOv8n achieved the highest accuracy with a mAP@50 of 89.3% and mAP@50-95 of 45%, along with a superior inference speed of 5.9ms. Faster R-CNN R50 FPN followed with a mAP@50 of 85.9% and mAP@50-95 of 41.9%, and RetinaNet R50 FPN achieved a mAP@50 of 71.6% and mAP@50-95 of 34.5%. The results underscore YOLOv8n's suitability for real-time defect detection due to its combination of high accuracy and fast processing speed, while the other models, although improved after augmentation enhancement, did not match its performance. This research demonstrates the potential of deep learning models for automating PCB defect detection with high accuracy and efficiency, focusing on ordinary single-layered PCB surfaces. While effective, it does not address defect detection in multi-layered PCBs and faces challenges like defect complexity, data imbalance, and limited samples. Future work can explore multi-layered PCBs, improve model robustness and generalization, employ advanced augmentation techniques, and enhance model interpretability for practical reliability.
KW - data augmentation
KW - deep learning
KW - object detection models
KW - PCB defect detection
KW - YOLOv8n
UR - https://www.scopus.com/pages/publications/105000691091
U2 - 10.1109/ICAAEEI63658.2024.10899172
DO - 10.1109/ICAAEEI63658.2024.10899172
M3 - Conference contribution
AN - SCOPUS:105000691091
T3 - ICAAEEI 2024 - 1st International Conference of Adisutjipto on Aerospace Electrical Engineering and Informatics: Shaping the Future Work for the Aerospace Technology in Science, Engineering, and Industry in the Disruptive Era
BT - ICAAEEI 2024 - 1st International Conference of Adisutjipto on Aerospace Electrical Engineering and Informatics
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1st International Conference of Adisutjipto on Aerospace Electrical Engineering and Informatics, ICAAEEI 2024
Y2 - 11 December 2024 through 12 December 2024
ER -