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A study of the effects of annealing and outgassing on hydrogenated amorphous silicon

  • P. J. Jennings*
  • , J. C.L. Cornish
  • , B. W. Clare
  • , G. T. Hefter
  • , D. J. Santjojo
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Annealing and outgassing of thin films of hydrogenated amorphous silicon (a-Si:H) are shown to produce major structural changes in the material. Outgassing can occur in three stages with thresholds at 350°C, 450°C and 575°C corresponding to conversion of SiH3 groups to SiH2 and SiH; conversion of SiH2 groups to Si and SiH; and conversion of SiH to Si respectively. Heating to 575°C also appears to remove most of the hydrogen from vacancies and defects in the material. Such heat treatments could be useful for improving the stability of thin film a-Si:H devices.

Original languageEnglish
Pages (from-to)156-160
Number of pages5
JournalThin Solid Films
Volume310
Issue number1-2
DOIs
Publication statusPublished - 21 Nov 1997
Externally publishedYes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Annealing
  • Hydrogenated amorphous silicon
  • Outgassing

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