Abstract
Annealing and outgassing of thin films of hydrogenated amorphous silicon (a-Si:H) are shown to produce major structural changes in the material. Outgassing can occur in three stages with thresholds at 350°C, 450°C and 575°C corresponding to conversion of SiH3 groups to SiH2 and SiH; conversion of SiH2 groups to Si and SiH; and conversion of SiH to Si respectively. Heating to 575°C also appears to remove most of the hydrogen from vacancies and defects in the material. Such heat treatments could be useful for improving the stability of thin film a-Si:H devices.
| Original language | English |
|---|---|
| Pages (from-to) | 156-160 |
| Number of pages | 5 |
| Journal | Thin Solid Films |
| Volume | 310 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 21 Nov 1997 |
| Externally published | Yes |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- Annealing
- Hydrogenated amorphous silicon
- Outgassing
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